JPH0587973B2 - - Google Patents

Info

Publication number
JPH0587973B2
JPH0587973B2 JP60080809A JP8080985A JPH0587973B2 JP H0587973 B2 JPH0587973 B2 JP H0587973B2 JP 60080809 A JP60080809 A JP 60080809A JP 8080985 A JP8080985 A JP 8080985A JP H0587973 B2 JPH0587973 B2 JP H0587973B2
Authority
JP
Japan
Prior art keywords
wiring
insulating film
forming
etching
interlayer insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60080809A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61239646A (ja
Inventor
Fumihide Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP8080985A priority Critical patent/JPS61239646A/ja
Publication of JPS61239646A publication Critical patent/JPS61239646A/ja
Publication of JPH0587973B2 publication Critical patent/JPH0587973B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP8080985A 1985-04-16 1985-04-16 多層配線の形成方法 Granted JPS61239646A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8080985A JPS61239646A (ja) 1985-04-16 1985-04-16 多層配線の形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8080985A JPS61239646A (ja) 1985-04-16 1985-04-16 多層配線の形成方法

Publications (2)

Publication Number Publication Date
JPS61239646A JPS61239646A (ja) 1986-10-24
JPH0587973B2 true JPH0587973B2 (en]) 1993-12-20

Family

ID=13728792

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8080985A Granted JPS61239646A (ja) 1985-04-16 1985-04-16 多層配線の形成方法

Country Status (1)

Country Link
JP (1) JPS61239646A (en])

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63140634U (en]) * 1987-03-05 1988-09-16
JPS6411346A (en) * 1987-07-03 1989-01-13 Matsushita Electric Ind Co Ltd Manufacture of semiconductor device
KR100319896B1 (ko) * 1998-12-28 2002-01-10 윤종용 반도체 소자의 본딩 패드 구조 및 그 제조 방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50123284A (en]) * 1974-03-18 1975-09-27
JPS5828735A (ja) * 1981-08-13 1983-02-19 Toshiba Corp Ｘ線撮影装置におけるフイルム搬送装置
JPS5967649A (ja) * 1982-10-12 1984-04-17 Hitachi Ltd 多層配線の製造方法
JPS60100452A (ja) * 1983-11-07 1985-06-04 Oki Electric Ind Co Ltd 半導体装置の製造方法

Also Published As

Publication number Publication date
JPS61239646A (ja) 1986-10-24

Similar Documents

Publication Publication Date Title
JP2561602B2 (ja) 多層金属配線構造のコンタクトの製造方法
JPH0587973B2 (en])
JP3040500B2 (ja) 半導体装置の製造方法
JP2783898B2 (ja) 半導体装置の製造方法
JPS5833854A (ja) 半導体装置の製造方法
JPS61172350A (ja) 半導体装置の製造方法
JPS61222235A (ja) 半導体装置の製造方法
JPH0621240A (ja) 半導体装置の配線接続構造及びその製造方法
JPH0595048A (ja) 半導体集積回路装置の製造方法
JPH02170553A (ja) 半導体装置の製造方法
JPH0123944B2 (en])
JPH05160126A (ja) 多層配線形成法
JPS6134956A (ja) 配線層の形成方法
JPH0415925A (ja) 半導体装置の製造方法
JPS63312657A (ja) 半導体集積回路装置の製造方法
JPS5911647A (ja) 半導体装置の製造方法
JPS6184033A (ja) 半導体装置及びその製造方法
JPS60227440A (ja) 半導体装置の製造方法
JPS6235537A (ja) 半導体装置及びその製造方法
JPS60152043A (ja) 多層配線構造の形成方法
JPS60251645A (ja) 半導体基板の多層配線形成方法
JPS61180456A (ja) 半導体装置の製造方法
JPH03248533A (ja) 半導体集積回路装置
JPS60111441A (ja) 半導体装置のコンタクトホ−ルの形成方法
JPH01122140A (ja) 多層配線の形成方法